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2009 International Printed Circuit & Electronics Assembly Fair on December 2 ~ December 4.
2009-12-08
 
We thank you very much for your attendance.
 

 

Date/Time: 2009/12/2 (Wed.) ~ 2009/12/4 (Fri.)

 

Venue: Shenzhen Convention & Exhibition Center, China


Booth No.: T01

 

Exhibition Topic :

 

·    High Aspect Ratio Drill 0.20mm x 4.6mm

·    High Aspect Ratio Drill 0.25mm x 5.5mm

·    High Aspect Ratio Drill 0.30mm x 6.5mm

·    Micro Drill Bit Series for Rigid-Flex boards

·    Special Diameter 0.09mm contrast with 0.10mm

·    Special Diameter 0.125mm contrast with 0.15mm

·    Special Diameter 0.175mm contrast with 0.20mm

·    Composite Blank (shank 2.0) Drill Bit Series

·    Composite 2-Blade Router Series for BOC Routing

 
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